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September 1998

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Subject:
From:
Jeff Perkins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Sep 1998 11:03:46 -0400
Content-Type:
text/plain
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        I have not seen acoustic microscopy successfully used to detect solder
cracks (not enough of a gap in the crack).  Perhaps you may want to contact
the CSAM folks to see if they've successfully accomplished it.
        Jeff Perkins
        Photocircuits

-----Original Message-----
From:   Jim Marsico 516-595-5879 [SMTP:[log in to unmask]]
Sent:   Tuesday, September 29, 1998 7:48 AM
To:     [log in to unmask]
Subject:        Re: [TN] ASSY: BGA FAILURES

Well, how about it!  Does anyone have any experience using ultrasound to
detect
cracked solder joints?  Does anyone know of a testing lab that can perform
this
function?

Thanks again...

Jim Marsico


Mark wrote:

Dear Jim

This may be a very stupid idea, but what about using ultrasound?

I believe they use ultrasound to detect microscopic fractures in mechanical
assembly's and the joint between the CBGA and the solder ball is
mechanical.

I don't know what the ultrasound would do to the chip or the wire bonds but
it may be worth some more inquiries to the component manf.

I would be very interested to read how you got on.

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