Well, how about it!  Does anyone have any experience using ultrasound to detect
cracked solder joints?  Does anyone know of a testing lab that can perform this
function?

Thanks again...

Jim Marsico


Mark wrote:

Dear Jim

This may be a very stupid idea, but what about using ultrasound?

I believe they use ultrasound to detect microscopic fractures in mechanical
assembly's and the joint between the CBGA and the solder ball is mechanical.

I don't know what the ultrasound would do to the chip or the wire bonds but
it may be worth some more inquiries to the component manf.

I would be very interested to read how you got on.

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