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September 1998

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Subject:
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 28 Sep 1998 08:50:00 -0400
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TEXT/PLAIN
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TEXT/PLAIN (35 lines)
Hi, Technet:

We've been experiencing approximately 5% failures on 228 ceramic BGAs for open
circuits.  Evaluation of the suspected components revealed a ball attachment
problem to the component solder pad.  We've seen anywhere from partial wetting
up to total non-wetting of some of the component pads.  These devices are
"dimpled" BGAs, where the pads are recessed approximately .006" below the
bottom surface, so it is conceivable that the solder balls are just held in
place, without any metallurgical bond to the component metallization.

Can anyone offer any suggestions as to how we can inspect these components to
detect the solder defect prior to assembly?  X-ray doesn't work, and I don't
think laminar x-ray would either.  Are there any other inspection systems that
could be used?

Thanks in advance,

Jim Marsico
AIL Systems Inc.
(516) 595-5879
[log in to unmask]


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