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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 24 Sep 1998 08:15:07 EDT |
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Hi 'DWEBER',
Are you sure you have sulfur present? It is much more likely, that you have
tin/silver intermetallic compound (IMC) formation. I am sure you have heard of
'gold embrittlement' which results from the formation of tin/gold IMCs; well
tin/silver IMCs are much worse. This was found out in the 1982-3 time frame
after TI silver-plated some PLCC leads with silver and the components fell off
the PCBs at IBM-Austin.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]
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