Hi Daan and Technetters,

You can use the regular SMT adhesive (which holds bottom side components
during the wave solder process) for this task. In our case it is the Heraeus
PD 911. This  adhesive cures during a standard reflow profile even before
the solder melts. It will fix the position of the heavy component before it
gets soldered and it again will hold the component during your second side
reflow when it is top side down.

Klaus Giese
Siemens, Karlsruhe - Germany

> -----Ursprüngliche Nachricht-----
> Von:  d. terstegge [SMTP:[log in to unmask]]
> Gesendet am:  Donnerstag, 24. September 1998 15:35
> An:   [log in to unmask]
> Betreff:      [TN] Adhesive for double sided reflow soldering
> 
> 
> Hi Technet,
> 
> I'm looking for an adhesive that can be used for keeping heavy components
> in place during double sided reflow soldering. Up to now we're using
> PC-flexmask (the latex-type mask that is normally used for wave soldering)
> but this material needs a couple of hours to cure, and cannot withstand
> the cleaning of intermediate  paste-misprints. 
> The adhesive should have  following properties :
> - fast curing, preferably at room temperature.
> - withstanding soldering temperatures and cleaning (in aliphatic
> hydrocarbon solvent)
> - easy to remove after assembly, although visible residues are acceptable
> - adhering to plastic and ceramic parts, and to solderresist
> - nonconductive, non corrosive
> Any suggestions ?
> 
> Daan Terstegge
> Signaal Communications
> * Unclassified *
> 
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet 
> ################################################################
> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
> section for additional information.
> For technical support contact Hugo Scaramuzza at [log in to unmask] or
> 847-509-9700 ext.312
> ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################