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September 1998

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Subject:
Re: PCB Material Change
From:
Joe Malley <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 2 Sep 1998 14:43:31 -0400
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Joe G Malley@MACDERMID
09/02/98 02:43 PM
Kathy,

The replacement of a di-functional resin system with a tetra-functional
resin system should make the PWB's more reliable.  The tetra-functional
material will typically have a higher Tg and a lower z-axis expansion
value.  The lowering of thermal expansion should put less stress on the
barrel of the hole and on the interconnects during assembly.

I can't comment on the solder mask issues as I have no experieince with one
of the masks.

Joe Malley

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