Hi all

I have a mixed technology double sided board.  It has about 900
components w/ 250 passive components on bottom.  The total project is for
only 15 boards and 2 boards were manufactured for first article test.
Since the total account was for such small quantity I ran all 15 boards
thru SMT.  The process was:  top side reflow, bottom side epoxy, PTH
insertion, wave.  Problem is that our customer found 1 solder short
across a cap on the bottom side, and so he is questioning my process of
epoxying the bottom side.  Even though he is a manufacturing engineer, he
is not knowledgable in PCB assembly processes.  How can I explane to him
that any failure in a component is wrong, but 1 out of 500 components( 2X
250 on bottom) is an acceptable figure that I do not see a need for
change.  He insists that since his past CM used reflow and then a pallet
thru wave, that that is a superior process.

He also questioned the fact that solder short on that particular location
happened only to 1 board.  And that if I took a systematic process, then
the solder short should exist on both boards.

Fellow Technetters,  tell me how I can deal with such complaints.

Thanks for all your input.


Tom Han
Ardent Systems

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