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September 1998

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Subject:
Soldering BGA's with Nitrogen
From:
"Simonson, Tom (MN51)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 22 Sep 1998 10:10:43 -0500
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At Honeywell Commercial Avionics Systems we are developing a BGA/CSP test
card and part of the test is to see what affect reworking the packages has
on the long term reliability of the part.  Presently we do not use nitrogen
to reflow solder our assemblies but we are considering to use it at our
rework station.  My question is, will the use of nitrogen cause the eutectic
balls to collapse more so than with air?   Or is it purely based on the
geometries of the land patterns???

Thanks in advance

Tom Simonson

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