TECHNET Archives

September 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Alan Kreplick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 22 Sep 1998 11:15:37 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (33 lines)
Jim,

Both your normal 250F bake and their 275F bake are Band-Aids to the bareboard
manufacturers process problems.

From a hands-on prospective, I have not pre-baked in over 5 years for both
reflow and wave solder.  I've baked boards with known problems (per other boards
in manufactures datecode & lot), and still delaminated - even at their
prescribed 275F bake.

Eliminate your bake - you'll: reduce standard hours and cycle time, reduce
missing / loose parts (less handling); improve solderability, and improve
reliability (for any heat-sensitive components).

If all else fails, sing "Bad Boards, Bad Boards, what you gonna due . . " to the
"Bad Boys, Bad Boys" theme from "COPS".

Good luck,

Al

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################


ATOM RSS1 RSS2