>  From: "Leslie O. Connally" <[log in to unmask]>, on 9/18/98 9:49
>  AM:
>
>          OK
>
>  Hi Paul,
>
>          Copper thieving is simply the use of extraneous copper areas used
>  typically around or near high current density areas to prevent excess
>  plating in these areas.  The best example would be at the edge of a printed
>  wiring panel
>  (or border). Since sharp edges or corners are high current density areas, a
>  border is placed on the panel to thieve the thicker plating away from the
>  parts.
>
>  In some cases it can actually be implemented within the panel; for instance
>  where a high concentration of holes are located away from the rest of the
>  board.
>
>  This technology, to my knowledge, has been around probably as long as
>  plating itself, and is used in other plating technology besides Printed
>  wiring boards.
>
>  It should not impact the other requirements as the thieving areas do not
>  become part and parcel of the PWB or product.
>
>  I hope this helps,
>  Regards,
>  Les
>
>
>  >  From: Paul Truit <[log in to unmask]>, on 9/18/98 9:28 AM:
>  >  Question:
>  >  I'd like to know some background on copper thieving what it's exactly
>  used
>  >  for, how long has it been in use, etc.
>  >
>  >  I'd also like to know if this has any affect on the calculation of the
>  >  creepage distance between the high voltage (primary) side and the low
>  >  voltage
>  >  (secondary) side of a UL approved board.  Say we had a 10mm distance
>  between
>  >  primary and secondary, now 3 rows of 1mm dots are spaced evenly between
>  the
>  >  two sections, does this have any impact on the UL specifications on
>  creepage
>  >  distances?
>  >
>  >  Thanks
>  >  --
>  >  Paul Truit   Mfg Eng
>  >  RBB Systems, Inc.
>  >  8767 TR 513
>  >  Shreve, Oh 44676
>  >
>  >  Phone:  330.567.2906   ext. 246   Fax:  330.567.3925
>  >  mailto:[log in to unmask]
>  >
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