I want to open by flattering everyone on the list. Then move right into
a genuinely contrite request for some input.  I'm probably not the only
one wondering about the immediacey of demand for High Density Circuits
(build up/ sequential / requiring ablated holes.  I read an article in a
recent trade pub that sez; Japan is currently building approx 14,000
sq.meters per month. I translate this as approx. 10,000 18x24 panels per
month. The story goes on to project a 30% increase by year end '98.

This dosen't seem like a lot to me.  I suspect much less here in the
States. (I'm not including the BGA or Transposer product which is
replacing ceramic substrates.)

The Question:  What products are driving the demand for this process?
               Are we satisfying the need for smaller space requirments?
               Are we satisfying the need for faster signal speed?
               How far away is the horizon for these applications?
               Are these all products we will be buying?

Any and all input is welcome and appreciated.

Thanks in advance,

Mark Simmons
ps  i promise to get a spell checker in the near future.

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################