In a message dated 9/16/98 2:31:01 PM Pacific Daylight Time, [log in to unmask]
writes:

 >Now hold on there a daburn minute, son.
 >Before you go off obliterating that poor ol' circuit board (kinda like you
did
 >to that privy when you was messin' around with the hydrogen and gawd knows
 >what else)

Sam, Sam, Sam.....you know good and well what I was messin' with when the
privy blew, 'twas that mason jar full of licker you had hid beneath that pile
of Field and Streams you keep out there...that one jar was a bit stronger than
the stuff you use ta' git from abe over cross the holler...

>might consider that the reason them there high temp interconnects are on
there is so that they don;t collapse.  Therefore they provide a >standoff
which offers more resiliance to temperature cycles than eutectic (63/37)
collapsed interconnects.

well Sam, I ain't no dummy...all the other fellers said that yestiddy...but
they was jawin' 'bout ceramic BGA's, not micro-bga's...you know, those ones
with the teeny tiny balls...kinda' like what maw was speakin' of when she saw
you runnin' naked after that ewe after drinkin' some of that juice ya' got
from abe...

>Seen 'em as high temp columns (IBM) and high temp balls (kinda like yours
after that privy accident -he he, grin). So there  ya go, boy,  >Check out
papers by IBM as well as articles in Circiuts Assembly and SMT.  Now git
screwing around on the computer and git some work >done.

Ya' still ain't answered my question Sam...is 219 degrees C. too low of temp
to peak at for reflowing micro-BGA? Now, I'll git back to work...jes' as long
as you promise not to git all lickered up and chase them thar ewes all over
the pasture...

-Steve "I didn't mean ta blow the privy up" Gregory-

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