Hello All,

     Yesterday there was a discussion about BGA opens,  which lead to some
discussion about high temperature balls on BGA's. I had mentioned that I had
just assembled a board with a micro-BGA, and I thought that the device may
have had high temperature balls on it since I didn't notice the spheres
collapsing after reflow like I've seen with larger packages.

     I plotted the board with a super mole and placed one of the thermocouples
beneath a PLCC 44 that's in the area of the micro BGA to sort of simulate the
thermal loading, since I could do that on the PLCC and still pull the
thermocouple off the board after reflow, which I couldn't do with the micro
BGA ..this board is a prototype and there's only 5 of them for the time being.

My thinking was that if I was good beneath the PLCC, I'd be oakie dokie on the
micro BGA. I peaked at 219 and was above liquidous for about 40 seconds, but I
read yesterday that I was too low at 219 degrees C. could someone please
expand on that? (hint, hint,...Werner?) This has got me sorta
confused...actually, I thought I might have been a tad high in temps...

I'd 'preciate it!!

-Steve Gregory-

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