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September 1998

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Subject:
Buried Vias
From:
"Blazi, Eric - LYPMPA" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 16 Sep 1998 11:49:26 -0400
Content-Type:
text/plain
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text/plain (27 lines) 
Hi,

We are venturing into buried vias and are having trouble with the
plating and imaging.  The design parameters are five mil lines and
spaces on 1/2 ounce copper layers of five mil core.

Our main trouble seems to be in the plating process.  We are having
trouble applying a smooth layer of copper.

I would appreciate any help from my fellow technetters.

Thanks

Erci Blazi

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