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September 1998

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 14 Sep 1998 21:32:58 -0500
Content-Type:
text/plain
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text/plain (64 lines)
Dear Colleagues:

On the day that we sent out notice of J-STD-003A for review, our Novell GroupWise
Mailbox <tech_doc> became corrupted.  As a result, most people that requested the
document had their e-mail bounced back to them and they did not receive the document
for review.

We generated a new mailbox called <techdoc>.  During the set-up, one message got
caught in a loop, and I appreciate the patience and understanding of those people
that received extra the messages last Thursday night. We have now tested this
thoroughly, both internally and externally, and it has proven to work correctly for
four days.

THE PROCEDURE TO REQUEST A COPY OF THE DOCUMENT TO REVIEW HAS CHANGED ONLY TO REQUIRE
THE USE OF A DIFFERENT E-MAIL ADDRESS WHICH IS NOW <techdoc>. Please note that the
subject line must be exactly:  Request 003A

From the original message, with corrections:

September 8, 1998

TO:  ALL MEMBERS OF THE Printed Wiring Board Solderability Specification Task Group,
5-23a

SUBJECT:  Proposal of J-STD-003A, Solderability Tests for Printed Boards

Dear Colleagues:

A copy of the Proposal of J-STD-003A, Solderability Tests for Printed Boards, is
available for your review. The file is in PDF format and can be opened with the
freeware Adobe Acrobat Reader (www.adobe.com). To receive your copy of the document,
send an e-mail to [log in to unmask] with a SUBJECT line of "REQUEST 003A". Please
include your name, company name and phone number in the body of the message in case
we need to contact you to resolve e-mail problems.

IF YOU ARE RECEIVING THIS NOTICE BY FAX (because we do not have a working e-mail
address for you) OR if you would prefer a hard copy mailed to you, please contact
Mary Tunk at (847) 790-5325 to arrange delivery of this standard.

Comments are due as soon as possible, or by October 15, 1998 at the latest.

Your continued participation in this task group may be contingent on the return of
the document comment form.

We would like to give special thanks to Dave Hillman, Rockwell for chairing the
Printed Wiring Board Solderability Specification Task Group.

Cordially,
Jack Crawford
Project Manager
[log in to unmask]

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