The  IPC refers to it as HDIS or Highdensity interconnect substrates.
HDI is actually a registered trademark of GE , SLC is a registered
trademark of IBM , Another  common useage in the States is also SBU for
sequential buildup, A few folks out there use the term BUM , but most
people agree that is a bad name to give to a product of process, as in
"it's a bummer dude"
 ----------
From: Joe Malley
To: [log in to unmask]
Subject: Re: [TN] Buildup Wiring Boards
Date: Friday, September 11, 1998 5:19PM

Joe G Malley@MACDERMID
09/11/98 11:19 AM
Warren,

I most often see this technology written as "build-up board" in the U.S.
although I saw many other spellings/acronyms when I was working in
Japan.
Other terms used were:  "SLC" - (sequentially laminated circuits?) used
first by IBM in Yasu, Japan; "HDI" for high density interconnects, and
"microvia" technology which seems recently to be gaining in popularity.

Joe Malley
MacDermid Incorporated




"Dr. Warren Smith" <[log in to unmask]> on 09/10/98 10:08:16 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
respond
      to "Dr. Warren Smith" <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Joe G Malley/MacDermid/MACDERMID/US)
Subject:  [TN] Buildup Wiring Boards




This ought to be a very simple question, but I have spent an hour on the
web
trying to find the answer unsuccessfully --

What is the proper spelling of "buildup wiring board" ("build up wiring
board"; "build-up wiring board")?

Thanks.

Warren Smith

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