At a previous employer, I had a line where we reflowed single sided panels
(including parts that could not be wave soldered), put the panel on a
masking pallet, and wave soldered through hole parts. Yield was very good
on both operations, and significantly improved over selective and hand
solder. Using an all SMD panel with that design would add a few dollars to
a low cost assembly.

Pallets were obtained from a standard pallet manufacturer. I have used SPS
precision in CA and Midwest Circuit Products in Cleveland. There are a
dozen others that I heard can also do good work. Most can also design the
pallets for you.

ARIC PARR
Sr. Manufacturing Engineer
Eaton Corp
1400 S. Livernois
P. O. Box 5020
Rochester Hills, Mi 48308-5020
[log in to unmask]
248 608 7780
Fax: 248 656 2242
-------------
Original Text
From: C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG, on 9/1/98 5:43 PM:
To: Aric Parr@01635@Lectron_RH,
EatonWHQ@CorpMail@WHQCleveOH[C=US/A=INTERNET/DDA=ID/TechNet(a)IPC.ORG]

Hello all,

I am looking for feedback on anyones experience in dual mode (SM and TH)
manufacturing.

We have one SM device, QFP, located in the middle of the PWB with other
components surrounding it. We want to reflow the QFP, and then do other
placements and then wave solder. We are evaluating masking methods for the
QFP in the wave process.

I would appreciate any feedback on methods tried, and results experienced.
If you have a very positive experience with a specific vendor, I would not
mind receiving that info also.

I appreciate in advance the response and your time in this.

Richard Hamilton
Clemar Mfg. / Rain Bird
[log in to unmask]

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