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September 1998

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Subject:
fine pitch BGA soldering pad size
From:
ginsing <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 2 Sep 1998 21:56:28 +1200
Content-Type:
text/plain
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text/plain (23 lines) 
Hi, can anyone suggest the opitimum soldering pad size for fine pitch
uBGA 0.8mm pitch 0.5mm dia. ball & 0.5mm pitch, 0.33mm dia. ball
respectively. Is there any rule of thumb regarding soldering pad size
for  uBGA.

Your help will be much appreciated.

Regards,

Gina

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