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September 1998

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Subject:
From:
Earl Moon <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 14 Sep 1998 06:27:48 -0700
Content-Type:
text/plain
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Mike,

We did bunches of this type testing back in the LCCC days using various
PCB material types. I cannot speak to all requirements you intend
determining, but I am happy to see you going for it. I am currently
working with a company (as I have many times) doing HALT for flight
systems to design more reliable product and provide CPI.

In the 1980's, we developed many new designs using CIC, Kevlar, and
Carbon MLB composite materials. We then were able to effect better
product capable of ensuring device, MLB, and solder joint integrity,
quality, and long term reliability by more closely matching TCE
parameters for them all.

Earl Moon

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