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September 1998

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Subject:
Re: Process Audit Points [ HELP ]
From:
"(No Name Available)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sat, 12 Sep 1998 19:19:55 EDT
Content-Type:
text/plain
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text/plain (27 lines) 
SMT audit.
I don't know if you are wanting to analyze what is causing your failures if so
this will not help.

If you are just wanting to audit your process then this might help.

We audit after solder paste deposit, pick-and-place set up, after components
are placed and after reflow.  If any of these areas are out of control then we
go to the root cause of the problems.

If you are wanting the variable causes there was a fishbone chart that was
passed out not to long ago that someone might still have.

Linda

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