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September 1998

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Subject:
From:
Ryan Chase <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 11 Sep 1998 12:13:51 MDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (145 lines)
There is something called an Industrial Trade Design, which if I
remember correctly does cover manufacturing and assembly processes.
Basically if you invent a better way of manufacturing something, you
can apply for patent protection and then sell this assembly process.

I have some books on this subject at home I will check this weekend
and get back to you.

Ryan Chase
> Date:          Fri, 11 Sep 1998 12:44:02 -0400
> Reply-to:      [log in to unmask]
> From:          Ryan Jennens <[log in to unmask]>
> Organization:  Phoenix Engineering Design, Inc.
> Subject:       Re: [TN] soldering patents
> X-To:          [log in to unmask]
> To:            [log in to unmask]

> Ed-
>
>     This sounds to me like a solid-solder-deposit technology, where the assembler purchases the bared PCB
> with the solder already deposited and reflowed.  The parts are then placed, with the help of tacky flux,
> and reflowed again.  The idea is to eliminate the pasted deposit process which is inherently difficult to
> accurately reproduce 100% of the time because it is so susceptible to so many variables. They claim they
> can reduce paste solder defects by up to 70-80%.   MaskTek and Sipad are two companies with proprietary
> applications of this technology.  I'm sure I'll read about it if I am wrong : )
>
> Ryan Jennens
> Phoenix Engineering
>
> Ed Holton wrote:
>
> > Fellow professionals:
> > Yesterday, while doing some research on soldering and a new soldering
> > method, I discovered that there is a number of U.S. patents for soldering
> > and soldering techniques.  I remember several months ago, there was some
> > discussion about another company having a general SMT assembly process
> > patent, but I never found out what the resolution of the issue was.  For
> > example, below is a copy of the abstract of U.S. Patent # 4,605,153 I found
> > during my research.  To me, this sounds like the reflow pads used for MELF
> > components.  I have used this pad numerous times over the years, getting
> > the idea, and seeing it discussed in SMT magazines, at NEPCON seminars, and
> > in the IPC design standards.  There were numerous other patents listed as
> > reference with this patent, all pertaining to soldering.
> >
> > I am not a patent lawyer, and my knowledge of law is limited to one
> > Business Law class in college and the reading of John Grishm novels.  I
> > consulted our company lawyer, and he has a basic knowlege of patent law,
> > but was unable to answer the question.  He could research it futher.  I
> > thought I would ask my fellow professionals first.
> >
> > The question:  If there is a U.S. Patent for a soldering process, can the
> > method be used by other companies for assembly? If it is a new process, is
> > permission needed, etc.?  If the process is already in use, learned as
> > described above, what are the legal ramifications?  All of my assembly
> > knowledge is based on practical experience, reading of journals, training
> > classes and discussions with you, my fellow professionals.  Never has
> > anyone ever stated that an assembly process is patented, and you must
> > obtain permission to use this process, or pay royalties, etc.  To find that
> > a SMT pad design is patented really amazed me, if this idea is patented, I
> > am sure that with futher research that there are numerous other patents for
> > all aspects of assembly and soldering.  At what point, or how is it
> > determined if the patent is proprietary or is it public domain?
> >
> > Thanks
> >
> > Ed Holton
> > Manufacturing Engineer
> > Hella Electronics
> >
> > THE PATENT:
> >
> > United States Patent
> >
> >             4,605,153
> >  Van Den Brekel, et. al.
> >
> >          Aug. 12, 1986
> >
> > Shaped solder pad for reflow soldering of surface mounting cylindrical
> > devices on a circuit board
> >
> >                                              Abstract
> >
> > A solder pad is provided at each end of a mounting position for a
> > cylindrical electronic device on a circuit board. Each solder
> > pad has two humps of solder spaced apart in a direction normal to the axis
> > of the device, the humps defining a channel in which
> > the end of a device can rest prior to being reflow soldered. The humps have
> >  a convex arcuate outer surface in plan view and
> > when viewed in a direction parallel to the axis of the device has a profile
> >  which is of convex arcuate form. The humps are
> > formed by depositing a thick patch of solder paste at each hump position
> > and heating the circuit board and solder paste to melt
> > the paste. After positioning of devices, the solder is reflowed to attach
> > the devices.
> >
> >  Inventors:
> >           Van Den Brekel; Jacques (Nepean, CA); Ho; Thomas K. Y. (Ottawa,
> > CA).
> >  Assignee:
> >           Northern Telecom Limited (Montreal, CA).
> >
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>

Ryan Chase
Manufacturing Engineer
GE Harris
403-214-4502
Fax 403-287-3107
[log in to unmask]

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