Hi Emmanuelle ,
The only study I know of, that studied this, however indirectly, is reported
in Reichelt, G., DeTeWe, Germany. Report on Results of German Joint Project
on SMT-Reliability to Working Group 2 of IEC Technical Committee TC91, Surface
Mounting Technology, Anaheim, CA, February 27, 1995, and Ehrich, M., M.
Kämpfert, D. Naujokat and G. Reichelt, “Lötstellensichtprüfung: Eine Kritische
Stellungnahme aus der Sicht von Dauerbelastbarkeitsuntersuchungen an
Oberflächenmontierten Keramikvielschichtkondensatoren mit Systematischen
Montageabweichungen,” Verbindungstechnik in der Elektronik, Vol. 7, Heft 1,
March 1995, pp. 44-51. It may have been also published somewhere in English,
you should look for references under the name Reichelt.
I reproduced some of the results in Engelmaier, W., and L. Turbini, “Design
for Reliability in Advanced Electronic Packaging,” Proc. Surface Mount
International Conf., San Jose, CA, August 1995, pp. 844-879.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]
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