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September 1998

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Subject:
From:
"Karalekas, Charles" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 11 Sep 1998 09:56:14 -0400
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I am seeking information on the feasibility of water soluble temporary
solder mask in our process.  We are using a closed loop water treatment
system which, from all the information I have been able to gather, dooms it
to failure due to the clay and other particulate matter in the masks which
would clog our mixed bed treatment filters.  Some of the other postings on
Tech Net regarding this issue are a bit old and I was curious to see if
there were any recent developments in the industry.  A separate cleaning
cycle would do the trick but its cost would not be justifiable versus manual
removal.
Charles Karalekas
Charles Karalekas
Engineer Specialist
Advanced Manufacturing Eng.
& Material Evaluation
Process Development
Northrop Grumman
847-259-9600 X6759
FAX 847-506-7905
E-Mail:[log in to unmask]

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