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September 1998

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Subject:
Underfill materials
From:
Xingsheng Liu <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 9 Sep 1998 17:39:27 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (28 lines) 
Hi, everyone,

Can anyone introduce me some underfill materials? Details of the
materials properties and vendor's information such as address, phone
number are appreciated. Thanks!

Have a nice day.

Xingsheng Liu



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