"Evaluation of Ni/Pd/Au as an Alternative Metal Finish on PCB" by Zequn Mei
and Ali Eslambolchi, is available from the SMTA.  You can buy the entire
proceedings or get just this paper (paper reprints are free for SMTA
members).  We will have them in stock soon.

Please contact me directly (i.e. not via TechNet) for more information.

Regards to all,

-David


At 03:02 PM 9/9/98 EDT, you wrote:
>All
>As far as gold embrittlement and gold diffusion,  you had better read Z.
Mei's
>paper given at the SMTA conference in late August 98.  He indicated in his
>research that gold may migrate back to the joint interface after aging for a
>length of time at somewhat elevated temperatures. Us who deal in
metallurgical
>reactions were amazed, but look at his research.  The paper is in the
>proceedings.
>
>Phil Hinton
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
>To subscribe:   SUBSCRIBE TechNet <your full name>
>To unsubscribe:   SIGNOFF TechNet
>################################################################
>Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
>For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
>################################################################
>

David Gonnerman
Director of Publications

Plan now to attend:
*Electronics Assembly Expo*
Providence, RI; Oct. 24-29, '98; http://www.ipc.org/html/assemexpo.htm

SURFACE MOUNT TECHNOLOGY ASSOCIATION
             Enabling members to achieve success
        in surface mount and companion technologies
    through education, training and access to knowledge.

5200 Willson Road, Suite 215, Edina, MN  55424-1343
           612-920-7682  F 612-926-1819
               [log in to unmask]   www.smta.org

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################