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September 1998

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Wed, 9 Sep 1998 21:04:34 EDT
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Howard:

Laser ablation materials come in two forms - copper foil with dielectric resin
coated on one side (one trade name is RCC), and also deposited dielectrics
which require all the copper to be added through plating.

Deposition methods for the coating of dielectrics include screen printing,
curtain coating, and dry film lamination.  Some makers of photoimageable
resists have also been checked to see if their products are easy for a laser
to ablate.

Lasers common in microvia production come with either UV or CO2 wavelengths.
Either laser works well with the deposited dielectrics.   However, the UV
laser is much more capable of "cutting" the copper foil of the resin coated
copper.   CO2 laser systems have usually opened copper "target holes" in the
copper with a print and etch technique using a photoresist image.

"Drilling" of microvias in deposited dielectrics can be much faster than
"drilling" with copper clad layers.

Electroless plating must be used to initiate conductivity in all microvias
anyway- deposited dielectrics just use the electroless plating to establish
conductivity over the entire board.

Please contact me off line to discuss the deposited dielectrics available from
MacDermid.

Dennis Fritz
MacDermid, Inc - Waterbury CT
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