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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 10 Sep 1998 10:13:17 EDT |
Content-Type: | text/plain |
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Hi Phil:
- Thanks for the wake-up call and for identifying the present requirements.
As a matter of fact I haven't read either the Mil-Specs. or the IPC standards
in the recent past, but was offering information based on my recollection of
the requirements in Mil-Std-2000 and IPC-D-275. I apologize for the
incorrect information and can only say that I was, as usual, in a hurry and
elected to do something quickly instead of correctly (sort of like an assembly
operation ;-). Guess I better read 6012 & 276 in my spare time. I am one of
the folks who would prefer thicker depositions (30 or more microinches) for
all applications, but the wide range of process windows and termination
geometry's renders a meaningful test (one with meaningful real world
applications) difficult or impossible. Regards, Jim Moffitt
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