hi,

as you are probably aware, the curing agent has a very large effect on
the properties of the cured system.  if you haven't had luck with a
manufacturer of molding compounds for these components, you should try
the shell chemical web site at:

http://www.shellchemical.com/

go to their products section and look for epon resins.  there are also
email addresses and telephone nos. for you to use.  they should be of
help.

phil crepeau

-----Original Message-----
From: Clive Ffitch [mailto:[log in to unmask]]
Sent: Wednesday, September 09, 1998 4:45 PM
To: [log in to unmask]
Subject: [TN] Biphenol Resins


     All,

     Can anyone supply typical values for the following thermal
properties
     of Biphenol Resins, as used for PED/PEM (particularly surface mount
     package) moulding compounds?

     I've searched all my usual sources, but only have figures for the
     (more common?) Epoxy Cresol Novalac Resins:

     Moulding Compound:         TCE:          Therm.Cond:        Tg:
                         (ppm x 10^6/degC)     (W/mdegC)       (degC)

----------------------------------------------------------------------
     Epoxy Cresol                16               0.67          155
       Novalac Resin      (some up to 20)                 (some up to
200)


     Biphenol Resin              ?                 ?             ?


     Thanks for any figures/information,

     Regards all,

     Clive ffitch
     Matra BAe Dynamics (UK)
     Stevenage, England

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