Hi there,

I am a new PCB designer, and as part of my training I have been asked
to investigate the limitations (and why these exist), and effects on
cost/yield etc of using fine line technology.

I would really appreciate it if you could pass on any information you may
have regarding the above topic. I have listed a few questions below that
I feel outline the scope of what I am expected to find out.

1) What are your minimum track width/spacing capabilities, and what is
the limiting factor?
    ie.  If you state your minimum is 5mil, why is it 5 rather than 4mil?
          Is this limit due to imaging process, or is it the etching process?

2) What about inner layers? Why are these different?

3) What about different types of boards, are these different? if so,
why?
        eg, flexible, teflon etc

4) Why do you charge more, the finer the line width/spacing?
     ie.   Why is 5/5 more expensive than 12/12?

If you have any questions/comments,  please don't hesitate to contact
me.

Best regards,
Craig McGlinchy
PCB Designer
Tait Electronics Ltd
Ph (64) 3 358-3399 extn 8509
Fax (64) 3 358-0432
email: [log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################