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September 1998

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Subject:
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 22 Sep 1998 10:30:00 -0400
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (27 lines)
Dear Ann,

(Oops, wrong advice column...)

Dear Technet:

We assembly an 8 layer polyimide SMT board (approximately 6" x 11" x .062
thick).  Our standard bake cycle for these boards prior to assembly has been
250 F for 6 hours.  We recently ran into a rash of delamination after reflow.
A board vendor recommended we bake at 275 F for 16 hours.  We feel that this is
excessive, and that our bake cycle should be adequate.  What do you think?

Thanks for your assistance,
Over-baked in NY

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