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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 30 Sep 1998 16:25:53 -0700 |
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Or you can consider to use epoxy base soldermask plug-in.
On Tue, 29 Sep 1998 18:08:02 -0400
"Wolfe, Robert" <[log in to unmask]> wrote:
> There is no problem with tented vias under chip type parts, however the
> solder mask cannot be dry film it is too thick, and if using LPI the via
> better be small enough to cover it adequately.
> Robert M. Wolfe
>
> -----Original Message-----
> From: glenn pelkey [SMTP:[log in to unmask]]
> Sent: Tuesday, September 29, 1998 4:41 PM
> To: [log in to unmask]
> Subject: [TN] Fab/Assy: Vias under chip components
>
> Does anyone see a problem with placing a via under a chip capacitor?
> The via will be tented with dry film soldermask. Assembly will be
> with
> epoxy or screened solder, reflow, and DI water clean.
>
> The potential for electrical shorts and remaining contaminates has
> us
> concerned.
>
> Thanks in advance for any input.
>
> Glenn Pelkey
> [log in to unmask]
> [log in to unmask]
> Maxtek Components Corp.
>
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