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Date: | Tue, 29 Sep 1998 10:43:16 -0700 |
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Jim-
I think I've read that Scanning Acoustic Microscopy (SAM) may not
reliably detect faulty or cold solder joints, BUT it may be worth
running by the people at Sonoscan Corp:
in San Jose, CA 408-456-0204
in Bensenville, IL 630-766-7088, 800-950-2NDT
-Michael Alderete
You wrote...
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Date: Tue, 29 Sep 1998 07:48:00 -0400
From: Jim Marsico 516-595-5879 <[log in to unmask]>
Subject: Re: ASSY: BGA FAILURES
Well, how about it! Does anyone have any experience using ultrasound to
detect
cracked solder joints? Does anyone know of a testing lab that can
perform this
function?
Thanks again...
Jim Marsico
Mark wrote:
Dear Jim
This may be a very stupid idea, but what about using ultrasound?
I believe they use ultrasound to detect microscopic fractures in
mechanical
assembly's and the joint between the CBGA and the solder ball is
mechanical.
I don't know what the ultrasound would do to the chip or the wire bonds
but
it may be worth some more inquiries to the component manf.
I would be very interested to read how you got on.
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