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Date: | Tue, 29 Sep 1998 11:03:46 -0400 |
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I have not seen acoustic microscopy successfully used to detect solder
cracks (not enough of a gap in the crack). Perhaps you may want to contact
the CSAM folks to see if they've successfully accomplished it.
Jeff Perkins
Photocircuits
-----Original Message-----
From: Jim Marsico 516-595-5879 [SMTP:[log in to unmask]]
Sent: Tuesday, September 29, 1998 7:48 AM
To: [log in to unmask]
Subject: Re: [TN] ASSY: BGA FAILURES
Well, how about it! Does anyone have any experience using ultrasound to
detect
cracked solder joints? Does anyone know of a testing lab that can perform
this
function?
Thanks again...
Jim Marsico
Mark wrote:
Dear Jim
This may be a very stupid idea, but what about using ultrasound?
I believe they use ultrasound to detect microscopic fractures in mechanical
assembly's and the joint between the CBGA and the solder ball is
mechanical.
I don't know what the ultrasound would do to the chip or the wire bonds but
it may be worth some more inquiries to the component manf.
I would be very interested to read how you got on.
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