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Date: | Tue, 29 Sep 1998 10:21:18 +0200 |
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What is the type of pad surface finish prior to BAll placement? Ni/Au, HASL,
OSP...
we also had recently problems with breaking between solder and CSP pad from
an japanese manuf.
They have just (!) to redevelope their Ni/Au process.
Regards
Wolfgang Nuechter
> Dr. Wolfgang Nuechter
> * Robert Bosch GmbH, Postfach 10 60 50, D-70049 Stuttgart, Germany
> * +49 711/811-7034 (BCN: 9020-7034) Fax: +49 711/811-7956, -266260
> e-* mailto:[log in to unmask]
>
>
> ----------
> Von: Mark Austin[SMTP:[log in to unmask]]
> Antwort an: TechNet E-Mail Forum.;Mark Austin
> Gesendet: Montag, 28. September 1998 18:00
> An: [log in to unmask]
> Betreff: Re: [TN] ASSY: BGA FAILURES
>
> Dear Jim
>
> This may be a very stupid idea, but what about using ultrasound?
>
> I belive they use ultrasound to detect microscopic fractures in mechanical
> assembly's and the joint between the CBGA and the solder ball is
> mechanical.
>
> I dont know what the ultrasound would do to the chip or the wire bonds but
> it may be worth some more enquiries to the component manf.
>
> I would be very interested to read how you got on.
>
>
> ===== Original Message from TechNet@PAT [log in to unmask] (TechNet E-Mail
> Forum.) at 28/09/98 13:50
> >Hi, Technet:
> >
> >We've been experiencing approximately 5% failures on 228 ceramic BGAs for
> open
> >circuits. Evaluation of the suspected components revealed a ball
> attachment
> >problem to the component solder pad. We've seen anywhere from partial
> wetting
> >up to total non-wetting of some of the component pads. These devices are
> >"dimpled" BGAs, where the pads are recessed approximately .006" below the
> >bottom surface, so it is conceivable that the solder balls are just held
> in
> >place, without any metallurgical bond to the component metallization.
> >
> >Can anyone offer any suggestions as to how we can inspect these
> components to
> >detect the solder defect prior to assembly? X-ray doesn't work, and I
> don't
> >think laminar x-ray would either. Are there any other inspection systems
> that
> >could be used?
> >
> >Thanks in advance,
> >
> >Jim Marsico
> >AIL Systems Inc.
> >(516) 595-5879
> >[log in to unmask]
> >
> >
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>
> Mark Austin (Process Engineer)
> ACW Technology Ltd
> Hylton Road
> Petersfield
> GU32 3XX
>
> TEL - (01730) 300000
> FAX - (01730) 266045
>
> DDI - (01730) 304401
> MA @ ACW.CO.UK
>
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