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From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 22 Sep 1998 10:30:00 -0400 |
Content-Type: | TEXT/PLAIN |
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Dear Ann,
(Oops, wrong advice column...)
Dear Technet:
We assembly an 8 layer polyimide SMT board (approximately 6" x 11" x .062
thick). Our standard bake cycle for these boards prior to assembly has been
250 F for 6 hours. We recently ran into a rash of delamination after reflow.
A board vendor recommended we bake at 275 F for 16 hours. We feel that this is
excessive, and that our bake cycle should be adequate. What do you think?
Thanks for your assistance,
Over-baked in NY
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