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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 1 Sep 1998 15:25:18 -0700 |
Content-Type: | text/plain |
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At our company, we reduced the amount of vacuum we pull and coated the back
of the film with a Teflon release film, Filmguard PPF1, from CIS. Both had
a measurable effect.
At 05:05 PM 9/1/98 -0400, you wrote:
>TechNet:
>
>We are getting a condition known as "artwork marking" when exposing LPI
>soldermask. This condition exhibits itself as shiny areas where the artwork
>comes into contact with any high spots on the mask.
>Although it appears to be totally cosmetic, we have a few customers who
>refuse to purchase boards with this condition.
>
>We primarily use Electra EMP110 soldermask with a Teledyne DSA 2000 spray
>coater. The panels are then tack dried in a tunnel oven for 45 minutes at
>180F.
>
>When imaging the panels, the top side (against the mylar) seems fine but
>the bottom (against the glass) is marked. The degree of marking varies
>depending on the surface of the board.
>
>Has anyone else seen this problem, or had the need to eliminate it?
>Also, what method do you use to ensure sufficient tack dry prior image, if
>any?
>
>Any responses would be appreciated
>
>Thank You
>John Lennox
>Process Engineer
>EMC
>
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