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Fri, 25 Sep 1998 12:02:45 -0500 |
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IPC-2221 (table 4-3) has the following information:
Gold (min) on areas to be wire bonded (ultrasonic)
Class 1: 0.05 um (micrometers)
Class 2: 0.05 um
Class 3: 0.15 um
Gold (min) on areas to be wire bonded (thermosonic)
Class 1: 0.3 um
Class 2: 0.3 um
Class 3: 0.8 um
Lisa Williams
Technical Project Manager
IPC
2215 Sanders Road
Nortbrook, IL 60062
www.ipc.org
>>> "(Eden Chen)" <[log in to unmask]> 09/25/98 04:16AM >>>
Dear Member,
I like to know the minimum thickness of bondable gold over nickel for
gold wire and aluminum wire. Which standard can i refer to?
Thank you very much.
Eden
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