IPC-SM-782a in section 8.1, page 3 of 4, says the following:
"Note:  If a more robust pattern is desired for wave soldering devices larger than
1608 [0603], add 0.2 mm to the y-dimension, and consider reducing the x-dimnension by
30%."

Lisa Williams
Technical Project Manager
IPC
2215 Sanders Road
Nortbrook, IL  60062
www.ipc.org

>>> Chris Ball <[log in to unmask]> 09/24/98 07:59AM >>>
Hello all,

Mary. We wave solder a lot of 1206's. Our standard pad config is 2/3 the
width of the part and has been for about 15 years. Every year or so,
someone comes along and says we should change our pads to 'IPC Standards'.
Where is it documented that the footprint should be 2/3 of the width of the
part? It would be nice to have a better response than "trust me, this is
what you want".

Thanks,
Chris Ball
ITT Automotive (formerly Delco Chassis/ soon to be Valeo)





.................
A different footprint is required for wave soldering than is for
reflow soldering.  The wave solder footprint must be narrower to
minimize the amount of solder that is retained.  For wave soldering,
the width of the footprint should only be 2/3 of the width of the
part.  During wavesoldering, the solder should form a nice concave
and feathered joint at each end of the component.  The solder joint
should not be bulged nor should it build up over the top of the
termination.
..................

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