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Tue, 22 Sep 1998 16:10:07 EDT |
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Hi John,
The advise from Frank N Kimmey is good; you may want to check cool-down rate
from reflow for being too fast and causing thermal shock cracking. Also, your
pads may still be dimensioned for wave soldering and be too big, thus creating
very large fillets. These cause compressive stresses in the chip components
when operation is in cold temperatures.
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]
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