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Mon, 21 Sep 1998 17:41:42 +0800 |
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Dear Member,
During thermal modeling for component using ANSYS or MARK, we need to
get the convective coefficient of heat transfer (h). Usually, we get
the h by trail and error. By comparing the simulation result to the
experimental result, we can determine the h.
I wonder whether someone has done research about the coefficient for
different size of commercial packaging, that can eliminate the
trial-error method for packaging engineer.
Eden
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