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August 1998

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Subject:
From:
"McMonagle, Michael R." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Aug 1998 09:37:05 -0500
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text/plain (59 lines)
Another system is the Bump-It system form Galahad (561-487-0271). It is
a semi-auto vacuum system that uses dedicated tooling for each component
type. The system is about $4500 and tooling about $500 each set.

Mike McMonagle
K*Tec Electronics
(281) 243-5639

> -----Original Message-----
> From: Jim Marsico 516-595-5879 [SMTP:[log in to unmask]]
> Sent: Thursday, August 06, 1998 7:03 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] BGA Reballing
>
> We're using a simple system from HTI Engineering (508-359-2786) which
> uses a
> two-stencil system.  The first stencil is used to manually squeegee
> solder
> paste (or paste flux) onto the component, and the other stencil (with
> larger
> apertures, is used to locate the solder balls.  It's not designed for
> high
> volume, it probably takes 3-5 minutes a component.  It works well and
> is
> relatively inexpensive, about $5k.
>
> Jim Marsico
> AIL Systems Inc.
> (516) 595-5879
> [log in to unmask]
>
>
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