Try
1.Fancort NJ
2. Knight tool co.
I do not have complete addresses. I know they do make for reconditioning
tools for QFPs.


Ashok Dhawan P.ENG.
Manufacturing Engineering
Unisys Canada Inc.
51 Burmac Road
Winnipeg R2J4C9
CANADA
Fone 204-257-9199
Fax   204-257-9104



> ----------
> From:         [log in to unmask][SMTP:[log in to unmask]] on
> behalf of V B VENKATESH[SMTP:[log in to unmask]]
> Sent:         August 26, 1998 8:52 AM
> To:   'TechNet E-Mail Forum.'
> Cc:   [log in to unmask]
> Subject:      RE: [TN] reforming a SOIC
> Importance:   High
>
> Mr. Jeremy Drake
> Sorry to interrupt your topic. Since it is of my interest I chipped
> in.
> We manufacture SMD transformers. The SMD bobbins have Gullwing pins.
> We have to solder the wires of the transformers to these pins and
> solder at about 430degrees. This puts stress on the pins and the pins
> loose their coplanarity. We have to maintain a coplanarity better than
> 0.1mm.
>
> Since your topic is similar I needed some advice  how to adjust it
> (presently we are adjusting manually which is VERY tiresome and
> difficult). Could you let me know if you have come across a machine
> which can do this job or any tool maker who can develop a tool for
> this adjustment??
>
> Thanks.
>
> V.B.Venkatesh
> http://www.hical.com
>
> -----Original Message-----
> From: Jeremy Drake [SMTP:[log in to unmask]]
> Sent: Wednesday, August 26, 1998 6:49 PM
> To:   [log in to unmask]
> Subject:      Re: [TN] reforming a SOIC
>
> Graham,
>      I wouldn't be happy hand reforming gull wings. You say that the
> bend
> will have to start at the component body. This means that a lot of
> stress
> will be put on the plastic to metal bond during the bending. Plastic
> mould
> compound doesn't have a particularly strong bond to leadframe metals
> at the
> best of times. This hand bending of the leads is likely to lead to
> delamination, giving an easy path into the package interior, wire
> bonds and
> die for corrosive contaminants.
>
>      Gull wing leads are originally formed by die sets that grip the
> leads
> before making the bend. The tooling doesn't grip the package at all.
> This
> prevents stressing the lead to plastic package interface.
>
>      Ideally I wouldn't do this. If I had to I would do some die
> penetration checks on some re-formed parts to see if there has been
> any
> delamination. If this shows no problems and you can be sure of the
> consistancy of the bends you make then it might be ok.
>
> You also need to consider the effect of the change in the lead shape
> on
> solder joint fatigue. The compliance of the lead is protecting the
> joint
> from the differential strains between the package and the board.
> Changing
> the lead profile will change the lead compliance. If it makes the lead
> too
> stiff then again there could be long term reliability problems.
>
> regards,
> Jeremy Drake
> Celestica
> ---------------------- Forwarded by Jeremy J Drake/HQ/CUK/Celestica on
> 26/08/98 13:15 ---------------------------
>
>
> "Collins, Graham" <[log in to unmask]> on 26/08/98 12:54:26
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
> respond
>       to "Collins, Graham" <[log in to unmask]>
>
>
>
>  To:      [log in to unmask]
>
>  cc:      (bcc: Jeremy J Drake/HQ/CUK/Celestica)
>
>
>
>  Subject: [TN] reforming a SOIC
>
>
>
>
>
>
>
> Technetter's
> Let's say a customer designed a board with the wrong pad size, too far
> apart, such that a gull wing lead placed on the pad doesn't have a
> heel
> fillet.  Obviously a bad thing.  A redesign is in progress, but in the
> interim it has been proposed that the part be reformed to spread the
> feet a
> bit further apart (by about 20 thou).  Component is a 20 lead SOIC.
>
> My questions and concerns are:
>  - the bend will have to occur at the point where the lead enters the
> component body, otherwise there will be no clearance between the part
> and
> the board.  How dangerous is this from a reliability perspective
> (class 3
> product, conformally coated)?  Should I take the next few weeks off?
> Flee
> the country?  Anyone have job openings?
>
>  - do any technetters have suggestions of a half decent way to reform
> these?
> I'm currently faced with doing it to about 100 to 150 parts, and doing
> it
> by
> hand does not appeal to me due to the variability.
>
> Any other suggestions?  I did consider borrowing some of the Freeze-it
> that
> Steve's using on his diodes, and shrinking the boards, but the reflow
> process might disagree with that...
>
> thanks!
>
> Graham Collins
>
>  << File: att-1.unk >>
>

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