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August 1998

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Subject:
Re: BGA Reballing
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Aug 1998 08:03:00 -0400
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (25 lines) 
We're using a simple system from HTI Engineering (508-359-2786) which uses a
two-stencil system.  The first stencil is used to manually squeegee solder
paste (or paste flux) onto the component, and the other stencil (with larger
apertures, is used to locate the solder balls.  It's not designed for high
volume, it probably takes 3-5 minutes a component.  It works well and is
relatively inexpensive, about $5k.

Jim Marsico
AIL Systems Inc.
(516) 595-5879
[log in to unmask]


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