TECHNET Archives

August 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Flux/Underfill
From:
Richard Haynes <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 6 Aug 1998 01:54:57 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (107 lines) 
Joseph,
In july 98 there was an article on Solder Bumping check out the home page
http://www.hdi-online.com
The dimensions of the bumps are very important for this technology this ref.
should do it for you I hope.
Richard Haynes
-----Original Message-----
From: Joseph H. Smith <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, August 05, 1998 11:58 PM
Subject: Re: [TN] Flux/Underfill


>Hi..
>
>Is there any kind of information on sphere solder balls?
>A standard tin/lead alloy and its diameter around 0.004 inches..
>
>I'll really appreciate it..
>
>Thanks
>
>Chang Ryu
>
>
>
>On Wed, 5 Aug 1998, Matthias Mansfeld wrote:
>
>> On  5 Aug 98 at 13:22, Hugo Scaramuzza wrote for Wolfgang Herbst
>> ([log in to unmask])
>>
>> > I heard about materials which combine flux and underfill for
>> > Flip-Chip applications. I would appreciate if someone can recommend
>> > the suppliers (contact address) and give some information about
>> > advantages and disadvantages (or experience?) with these materials.
>>
>> Try Emerson & Cuming (the producers of AMICON Series)
>>
>> European HQ: Nijverheidstraat 7, B-2660 Westerlo-Belgium
>> Phone: +32 (0)14/57 56 11, Fax: +32 (0)14/58 55 30
>> US HQ: 55 Hayden Avenue, Lexington MA 02173
>> Toll free 800-832-4929, Phome: (781) 402-9100, Fax: (781) 861-9590
>>
>> I saw at SMT/ESS/Hybrid fair 1998 in Nuremberg these new products:
>> Solder flux & underfill, fully SMT Process compatible,
>> AMICON E1330 Series: Does not cure through solder reflow (allowing
>> chip rework)
>> AMICON E 1350 Series: Cures during modified reflow cycle, no post
>> cure reqired.
>>
>> I don't have any experiences with these products, but (as I plan to
>> establish Flip-Chip prototyping) I would be very interested in
>> the results.
>> Hope this helps,
>> regards
>> Matthias Mansfeld
>> -----------------------------------------------
>> Matthias Mansfeld Elektronik
>> * Leiterplattenlayout, Bestueckung
>> Am Langhoelzl 11, 85540 Haar; Tel.: 089/4620 093-7, Fax: -8
>> Internet: http://home.t-online.de/home/matthias.mansfeld
>>
>> ################################################################
>> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
1.8c
>> ################################################################
>> To subscribe/unsubscribe, send a message to [log in to unmask] with
following text in the body:
>> To subscribe:   SUBSCRIBE TechNet <your full name>
>> To unsubscribe:   SIGNOFF TechNet
>> ################################################################
>> Please visit IPC's web site (http://www.ipc.org) "On-Line Services"
section for additional information.
>> For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
>> ################################################################
>>
>>
>
>################################################################
>TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
>################################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in the body:
>To subscribe:   SUBSCRIBE TechNet <your full name>
>To unsubscribe:   SIGNOFF TechNet
>################################################################
>Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section
for additional information.
>For technical support contact Hugo Scaramuzza at [log in to unmask] or
847-509-9700 ext.312
>################################################################
>
>

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2