Hi..

Is there any kind of information on sphere solder balls?
A standard tin/lead alloy and its diameter around 0.004 inches..

I'll really appreciate it..

Thanks

Chang Ryu



On Wed, 5 Aug 1998, Matthias Mansfeld wrote:

> On  5 Aug 98 at 13:22, Hugo Scaramuzza wrote for Wolfgang Herbst
> ([log in to unmask])
>
> > I heard about materials which combine flux and underfill for
> > Flip-Chip applications. I would appreciate if someone can recommend
> > the suppliers (contact address) and give some information about
> > advantages and disadvantages (or experience?) with these materials.
>
> Try Emerson & Cuming (the producers of AMICON Series)
>
> European HQ: Nijverheidstraat 7, B-2660 Westerlo-Belgium
> Phone: +32 (0)14/57 56 11, Fax: +32 (0)14/58 55 30
> US HQ: 55 Hayden Avenue, Lexington MA 02173
> Toll free 800-832-4929, Phome: (781) 402-9100, Fax: (781) 861-9590
>
> I saw at SMT/ESS/Hybrid fair 1998 in Nuremberg these new products:
> Solder flux & underfill, fully SMT Process compatible,
> AMICON E1330 Series: Does not cure through solder reflow (allowing
> chip rework)
> AMICON E 1350 Series: Cures during modified reflow cycle, no post
> cure reqired.
>
> I don't have any experiences with these products, but (as I plan to
> establish Flip-Chip prototyping) I would be very interested in
> the results.
> Hope this helps,
> regards
> Matthias Mansfeld
> -----------------------------------------------
> Matthias Mansfeld Elektronik
> * Leiterplattenlayout, Bestueckung
> Am Langhoelzl 11, 85540 Haar; Tel.: 089/4620 093-7, Fax: -8
> Internet: http://home.t-online.de/home/matthias.mansfeld
>
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