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August 1998

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 25 Aug 1998 08:47:13 -0400
Content-Type:
text/plain
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text/plain (57 lines)
Bobby,
First I would ask, is it a real insufficient or are your inspectors just a
little leery that the solder joints don't feather up the lead as well as a
normal tin/lead one?  We have also found that the wetting ability of the
palladium plated component leads is flux dependent.  So you might want to
start there, rather than actually changing solder chemistry. We have had
good results with both traditional no-clean fluxes and the new VOC free
ones.

regards,
Bev Christian
Nortel

> ----------
> From:         Bobby R. Mangona[SMTP:[log in to unmask]]
> Sent:         Tuesday, August 25, 1998 4:06 AM
> To:   [log in to unmask]
> Subject:      [TN] Insuff.Solder
>
> Hello Technetters,
>
>         It was pin pointed in my process that Insufficient solder on a
> particular component was due to a Nickel Palladium termination. It
> has a  leeching reaction that causes the Insuff.
>         The question is, Can this be resolve by using a solder paste with
> 2 % Ag . Currently I'm using 63/37 combination. Any inputs would be
> very much help and appreciated.
>
> Bobby M.
>
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