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| Date: | Tue, 25 Aug 1998 08:06:59 +0000 |
| Content-Type: | text/plain |
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Hello Technetters,
It was pin pointed in my process that Insufficient solder on a
particular component was due to a Nickel Palladium termination. It
has a leeching reaction that causes the Insuff.
The question is, Can this be resolve by using a solder paste with
2 % Ag . Currently I'm using 63/37 combination. Any inputs would be
very much help and appreciated.
Bobby M.
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