On  5 Aug 98 at 13:22, Hugo Scaramuzza wrote for Wolfgang Herbst
([log in to unmask])

> I heard about materials which combine flux and underfill for
> Flip-Chip applications. I would appreciate if someone can recommend
> the suppliers (contact address) and give some information about
> advantages and disadvantages (or experience?) with these materials.

Try Emerson & Cuming (the producers of AMICON Series)

European HQ: Nijverheidstraat 7, B-2660 Westerlo-Belgium
Phone: +32 (0)14/57 56 11, Fax: +32 (0)14/58 55 30
US HQ: 55 Hayden Avenue, Lexington MA 02173
Toll free 800-832-4929, Phome: (781) 402-9100, Fax: (781) 861-9590

I saw at SMT/ESS/Hybrid fair 1998 in Nuremberg these new products:
Solder flux & underfill, fully SMT Process compatible,
AMICON E1330 Series: Does not cure through solder reflow (allowing
chip rework)
AMICON E 1350 Series: Cures during modified reflow cycle, no post
cure reqired.

I don't have any experiences with these products, but (as I plan to
establish Flip-Chip prototyping) I would be very interested in
the results.
Hope this helps,
regards
Matthias Mansfeld
-----------------------------------------------
Matthias Mansfeld Elektronik
* Leiterplattenlayout, Bestueckung
Am Langhoelzl 11, 85540 Haar; Tel.: 089/4620 093-7, Fax: -8
Internet: http://home.t-online.de/home/matthias.mansfeld

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