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August 1998

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 21 Aug 1998 14:21:42 EDT
Content-Type:
text/plain
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text/plain (47 lines)
Hi Charlie,
You have a twofold problem; 1) how to solder attach the component, and 2) how
to keep the solder joints from failing in fatigue. Of the two the second is
the larger problem unless your application is in a very benign and stable
(non-cyclic) environment or your PCB is CTE-constrained (copper-Invar-copper
P/G layers) to 9 ppm/C or less.
You may have success with solder preforms (18 mil balls); this approach was
used at Bell Labs with a similar component (see Engelmaier, W., “BGA and CGA
Solder Attachments: Results of Low-Acceleration Test and Analysis,” Proc.
Surface Mount International Conf., San Jose, CA, August 1995, pp. 344-358;
also in Proc. NEPCON West ‘96, Anaheim, CA, February 1996, pp. 1020-1036; also
in Soldering & Surface Mount Technology, No. 24, October 1996, pp. 25-31)
resulting in 10-mil-high solder joints. For reliability solder columns (column
grid arrays) would work even better.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]


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