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August 1998

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Subject:
From:
"Thibodeau, Chad" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 5 Aug 1998 11:28:20 -0700
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We are having difficulty in soldering a particular manufacturer's 240 Pin
(20 mil) PQFP using a standard reflow process.  The defect we are seeing is
described as "pillowing effect" or "foot-in-the-mud effect" in which it
appears that the there is a wettability issue.  The difficulty with this
failure is that it is very random in nature, although supposedly not
uncommon.  If anyone has experienced a similar type of problem, PLEASE
respond with any information you can.  Your contribution will be very much
appreciated.  Thank you.

Chad Thibodeau
EF Data
Component Engineer
602 333-2138 Phone
602 921-9012 Fax
[log in to unmask]

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